DOOSUNG CO., Ltd.
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PRODUCTS
Total EMC / Thermal Products
IDSMT-W Series
Structure and Features
Excellent grounding characteristics from a wide area of grounding
Excellent electrical conductivity
The stabilization of components due to mounting levelly
Excellent reliability(repeated compression, brine-atomizing test pass)
Precise reel packaging for the accurate work
Superior thermo-stable characteristics
High adhesion after SMT
Impedance matching function of PCB or FPCB
Excellent Thermal Transfer
Excellent ESD (Electrostatic discharge)
Cushion and anti-shock after SMT
EMI noise attenuation its power loss property
Specifications
| Item | Test Method | Properties | |
|---|---|---|---|
| Material Description |
Base Material | - | Silicone rubber / PI Film |
| Color | Visual | Silver & Gold | |
| Operation Temp. | - | -40 ~ 120℃ |
|
| Service Temp. | Ref. Soldering condition | -40 ~ 265℃ | |
| Electric Resistance (Ω) | Origin | HIOKI 3540 mΩ HITESTER | Max. 0.1 |
| Thermo-hygrostat | Max. 0.1 | ||
| Brine Atomizing | Max. 0.1 | ||
| Thermal Shock | Max. 0.1 | ||
| Standard Size (mm) | Width | Digital Calipers | Order Size |
| Height | |||
| Length | |||
| Adhesion Strength (gf/cm) | Push Pull Gauge Speed : 0.5mm/sec |
Length: Min. 150gf / Width: Min. 200gf |
|
| Compression-Deflection Rate (%) | 20% Compression | Min. 95 | |
| 30% Compression, 48hr | Min. 90 | ||
| Flammability | UL 94 | UL 94-V1 | |
| RoHS & Halogen Free | Pb, Cd, Hg, Cr+6, PBBs, PBDEs, Br, Cl | N.D. | |
How to Order
P/N :
IDSMT
1
-
W
2
-
AAA
3
-
BBB
4
-
CCC
5
-
DDD
6
-
1Serial Number
2W : Wrapping
-
3Width (mm)
4Height (mm)
-
5Length (mm)
6Type : H[Sn plated Film with a hole]
HG[Au plated Film with a hole]
N[without a hole]
GN[Au plated Film without a hole]
- [ For Example ]
-
IDSMT-W-4-5-6-H
Wrapping
Width : 4mm
Height : 5mm
Length : 6mm
Type : H