Total EMC / Thermal Products
IDCF is recently developed by DSIC from SMD
Finger Strip for the use PCB featuring excellent resilience and electrical properties.
Item | Test Method | Properties | |
---|---|---|---|
Material description | Base Material | - | Conductive Silicone & Au plated Cu |
Color | Visual | Black/Dark gray/Gray | |
Service Temp (℃) | Internal Test method | 280 | |
Service Temp. (℃) | Internal Test method | - 40 ~ + 120 | |
Electric Resistance (Ω) | Origin | HIOKI 3540 mΩ HITESTER | Max. 1.0 |
Temp. & Humi. (50℃/95%RH) | Max. 1.0 | ||
Salt Spray | Max. 1.0 | ||
Thermal Shock | Max. 1.0 | ||
Standard Size (mm) | Width | Digital Calipers | Order Size |
Height | |||
Length | |||
PCB Adhesion Strength (gf/mm) | Push Pull Gauge Speed : 0.5mm/sec |
Length: Min. 150gf / Width: Min. 200gf |
|
Compression-Deflection Rate (%) | 20% Compression, 10,000회 | Min. 95 | |
30% Compression, 48hr | Min. 90 | ||
Flammability | UL 94 | UL 94-V1 | |
RoHS & Halogen Free | Pb, Cd, Hg, Cr+6, PBBs, PBDEs, Br, Cl | N.D. |
1Serial Number
2None : Hard Type , C : Soft Type
3Height (mm)
4Conductive Silicone Type : SC
Non Conductive Silicone Type : GS (Gap Supporter)
5Width (mm)
6Length (mm)
7G : Au Plated Cu Foil
Hard Type
Width : 2.5mm
Height : 0.7mm
Length : 1mm
Type : G
Soft Type
Width : 2mm
Height : 0.4mm
Length : 1mm
Type : G